Xorte logo

News Markets Groups

USA | Europe | Asia | World| Stocks | Commodities



Add a new RSS channel

 
 


Keywords

2024-12-13 22:10:31| Engadget

Bosch is the latest recipient of (preliminary) CHIPS and Science Act funding. The company signed a non-binding agreement with the US Commerce Department and could receive up to $225 million in funding. Lest you think Amazons gruff crime solver somehow got a piece of the action, Bosch is also a German multinational corporation that makes just about everything under the sun. (That even includes a stink-removal machine!) The company recently accelerated its silicon development, buying TSI Semiconductors in 2023 and finalizing the deal early this year. But instead of focusing on cutting-edge silicon for computers, phones and AI, Bosch specializes in chips for the auto industry. The company plans to use the funds on the Roseville, CA facility it acquired in the TSI deal. The company will invest up to $1.9 billion to convert the plant into one that spits out silicon carbide (SiC) semiconductors, which are used to boost the efficiency of EV driving and charging. Bosch expects the first 200mm wafers to come off the line there in 2026. The Roseville investment enables Bosch to locally produce silicon carbide semiconductors, supporting US consumers on the path to electrification, Paul Thomas, president of Bosch in North America and Bosch Mobility Americas, wrote in a statement. Boschs Roseville, CA silicon plantBosch In addition to boosting Americas primacy in the chip industry, the CHIPS Acts other goal is job creation. The White House says the proposed funding would create up to 1,700 jobs, including 1,000 in construction and 700 in manufacturing, engineering and R&D. Todays agreement catalyzes nearly $2 billion of private investment and the creation of over 1,700 jobs, while investing in a critical technology relied upon on by our defense and auto industry, wrote Natalie Quillian, the White House Deputy Chief of Staff. In November, Taiwan Semiconductor Manufacturing Company (TSMC), the worlds leading advanced chip maker, was the first to have its CHIPS Act grants (to the tune of $6.6 billion) finalized. Other recipients include Intel (although its funding was recently cut), HP, Samsung, GlobalFoundries, Texas Instruments and Rocket Lab.This article originally appeared on Engadget at https://www.engadget.com/computing/bosch-signs-agreement-for-up-to-225-million-in-chips-act-funding-211031263.html?src=rss


Category: Marketing and Advertising

 

Latest from this category

28.02This retro-inspired handheld comes with Banjo-Kazooie and Battletoads built in
28.02Alaska could be the next state to crack down on AI-generated CSAM and restrict kids' social media use
28.02Shuttered studio Bluepoint reportedly pitched a Bloodborne remake, but it got shot down by FromSoftware
28.02Everything announced at MWC 2026: The new Leica Leitzphone by Xiaomi, Honor's ultra-thin MagicPad 4 and more
28.02Xiaomi 17 Ultra hands-on: Incredible cameras, but maybe hard to get
28.02Leicas Leitzphone by Xiaomi has a huge 1-inch camera sensor and a stylish new design
28.02Steam Next Fest, a different flavor of The Witcher and other new indie games worth checking out
28.02OpenAI strikes a deal with the Defense Department to deploy its AI models
Marketing and Advertising »

All news

28.02Living Fresh Market holds 60-second shopping spree to celebrate Black History Month
28.02Hundreds of thousands of travelers stranded by flight disruptions after attack on Iran
28.02What to know about the clash between the Pentagon and Anthropic over militarys AI use
28.023 conversation-killers to avoid at work
28.02This retro-inspired handheld comes with Banjo-Kazooie and Battletoads built in
28.02Alaska could be the next state to crack down on AI-generated CSAM and restrict kids' social media use
28.02Shuttered studio Bluepoint reportedly pitched a Bloodborne remake, but it got shot down by FromSoftware
28.02Everything announced at MWC 2026: The new Leica Leitzphone by Xiaomi, Honor's ultra-thin MagicPad 4 and more
More »
Privacy policy . Copyright . Contact form .